cas 13818-44-5|| where to buy (2-oxo-1,3-dioxolan-4-yl)methyl methacrylate

Product Name:(2-oxo-1,3-dioxolan-4-yl)methyl methacrylate

IUPAC Name:(2-oxo-1,3-dioxolan-4-yl)methyl 2-methylprop-2-enoate

Packing Unit	Available Stock	Price($)
CM362981-1g	in stock	Ƌǲ
CM362981-5g	in stock	ƱǲȌ
CM362981-25g	in stock	ȌɐȌ

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: CAS NO:13818-44-5; Molecular Formula:C8H10O5; Melting Point:-; Smiles Code:CC(=C)C(=O)OCC1COC(=O)O1; Density:

: Catalog Number:CM362981; Molecular Weight:186.16; Boiling Point:; MDL No:; Storage:

: Dioxolanes; Dioxolane is a heterocyclic acetal with the formula (CH2)2O2CH2. It is related to tetrahydrofuran by exchanging an oxygen for the CH2 group. The isomer 1,2-dioxolane (in which the two oxygen centers are adjacent) is a peroxide. 1,3-Dioxolane is used as solvent and comonomer in polyacetal. The dioxolane-type and their hydrogenolysis can provide very valuable partially protected building blocks either for oligosaccharide syntheses or sugar transformations.

: Photoresist; Semiconductors could be termed as the most extensively utilized substance in the modern century. Polycrystalline wafers are used to make semiconductors. A single 300-mm silicon wafer may create hundreds of chips. Photoresist coatings and materials are an essential part of their fabrication as they are the main constituents of the photolithography process during the fabrication of the semiconductors. Photoresist is a mixed liquid that is sensitive to light. Its components include: photoinitiators (including photosensitizers, photoacid generators), photoresist resins, monomers, solvents and other additives. The photoresist can transfer the required fine pattern from the photomask (mask) to the substrate to be processed through photochemical reaction and photolithography processes such as exposure and development.