Product Name:4,4'-(1-(4-(2-(4-Hydroxyphenyl)propan-2-yl)phenyl)ethane-1,1-diyl)diphenol

IUPAC Name:4-(2-{4-[1,1-bis(4-hydroxyphenyl)ethyl]phenyl}propan-2-yl)phenol

CAS:110726-28-8
Molecular Formula:C29H28O3
Purity:95%
Catalog Number:CM247724
Molecular Weight:424.54

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Product Details

CAS NO:110726-28-8
Molecular Formula:C29H28O3
Melting Point:-
Smiles Code:CC(C)(C1=CC=C(O)C=C1)C1=CC=C(C=C1)C(C)(C1=CC=C(O)C=C1)C1=CC=C(O)C=C1
Density:
Catalog Number:CM247724
Molecular Weight:424.54
Boiling Point:623.1°C at 760 mmHg
MDL No:MFCD00191685
Storage:Store at room temperature.

Category Infos

Photoresist
Semiconductors could be termed as the most extensively utilized substance in the modern century. Polycrystalline wafers are used to make semiconductors. A single 300-mm silicon wafer may create hundreds of chips. Photoresist coatings and materials are an essential part of their fabrication as they are the main constituents of the photolithography process during the fabrication of the semiconductors. Photoresist is a mixed liquid that is sensitive to light. Its components include: photoinitiators (including photosensitizers, photoacid generators), photoresist resins, monomers, solvents and other additives. The photoresist can transfer the required fine pattern from the photomask (mask) to the substrate to be processed through photochemical reaction and photolithography processes such as exposure and development.